Featured Products
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors wh...
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our stand...
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors wh...
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors wh...
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors wh...
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our stand...
The OCU-400 family meets the requirements of low and medium power applications. OCU-400 UV-LED are available in the wavelengths range of 350nm …...
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our stand...
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors wh...
Popular Categories For OSA Opto
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OIS-330-IT855-X-TU, OSA Opto
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
Popular items
OIS-330-880-X-TU, OSA Opto
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
with lens, mounting from backside of PCB
View angle 40°
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
high radiant intensity type
Popular items
OCU-440-UE425-X-T, OSA Opto
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.
packages: 1515
size: 3.8mm x 3.8mm x 0.9mm
view angle: 120°
substrate: AlN Ceramic
for High Power applications
technology: InGaN
soldering pads: silver plated
suitable for all SMT assembly methods
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: AIN Ceramics
Lead free solderable, soldering pads:silver
taped in 12 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(T)
Popular items
OIS-330-IT940-X-TU, OSA Opto
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
Popular items
OIS-330-1050p-X-TU, OSA Opto
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
Popular items
OCI-440-1020-X-T, OSA Opto
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.
package: 1515
size: 3.8mm x 3.8mm x 0.9mm
view angle: 120°
substrate: AlN Ceramic
for High Power applications
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: silver plated
suitable for all SMT assembly methods
Popular items
OCU-400-UE365-X-T, OSA Opto
The OCU-400 family meets the requirements of low and medium power applications. OCU-400 UV-LED are available in the wavelengths range of 350nm … 435nm. The package family OCU-440 was developed for high power applications in the range up to 1.5 W electrical power dissipation. Based on discrete power devices like the OCU-440 package or bare dices OSA Opto Light offers customized solutions in conventional or COB technology.
Size 3,0x 2,0x 1,0 mm
circuit substrate: AI2O3 ceramics
encapsulation:AIN ceramics
Lead free solderable, soldering pads:gold plated
taped in 12 mm blister tape, cathode to transporting perforation
marking at anode
ALL Devices sorted into luminous intensity classes
taping:face-up(T)
Popular items
Popular items
OCI-440-915-X-T, OSA Opto
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.
package: 1515
size: 3.8mm x 3.8mm x 0.9mm
view angle: 120°
substrate: AlN Ceramic
for High Power applications
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: silver plated
suitable for all SMT assembly methods
Popular items
OIS-330-1020p-X-TU, OSA Opto
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
Popular items
New Items
New items
New items
OIS-330-IT855-X-TU, OSA Opto
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
New items
OIS-330-880-X-TU, OSA Opto
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
with lens, mounting from backside of PCB
View angle 40°
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
high radiant intensity type
New items
OCU-440-UE425-X-T, OSA Opto
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.
packages: 1515
size: 3.8mm x 3.8mm x 0.9mm
view angle: 120°
substrate: AlN Ceramic
for High Power applications
technology: InGaN
soldering pads: silver plated
suitable for all SMT assembly methods
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: AIN Ceramics
Lead free solderable, soldering pads:silver
taped in 12 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(T)
New items
OIS-330-IT940-X-TU, OSA Opto
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
New items
OIS-330-1050p-X-TU, OSA Opto
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
New items
OCI-440-1020-X-T, OSA Opto
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.
package: 1515
size: 3.8mm x 3.8mm x 0.9mm
view angle: 120°
substrate: AlN Ceramic
for High Power applications
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: silver plated
suitable for all SMT assembly methods
New items
OCU-400-UE365-X-T, OSA Opto
The OCU-400 family meets the requirements of low and medium power applications. OCU-400 UV-LED are available in the wavelengths range of 350nm … 435nm. The package family OCU-440 was developed for high power applications in the range up to 1.5 W electrical power dissipation. Based on discrete power devices like the OCU-440 package or bare dices OSA Opto Light offers customized solutions in conventional or COB technology.
Size 3,0x 2,0x 1,0 mm
circuit substrate: AI2O3 ceramics
encapsulation:AIN ceramics
Lead free solderable, soldering pads:gold plated
taped in 12 mm blister tape, cathode to transporting perforation
marking at anode
ALL Devices sorted into luminous intensity classes
taping:face-up(T)
New items
New items
OCI-440-915-X-T, OSA Opto
OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.
package: 1515
size: 3.8mm x 3.8mm x 0.9mm
view angle: 120°
substrate: AlN Ceramic
for High Power applications
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: silver plated
suitable for all SMT assembly methods
New items
OIS-330-1020p-X-TU, OSA Opto
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
New items
Don’t hesitate to ask questions for better clarification.