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Bluetooth Modules | Bluetooth Chip

What are Bluetooth Modules?

The aim of the Bluetooth module is to establish a secure connection among communicating devices, and this connection can be built by using a wireless connection or by attaching the devices to other communicating devices such as computers and laptops. These modules have embedded a device called a Bluetooth stack, and this device is referred to as a board or chip that is typically configured to perform Bluetooth functionality. It is a highly potential medium for data or signal communication among devices.

Bluetooth devices are available in a wide range of sizes, shapes, and types to be compatible with a broad range of applications. Thus, these devices are configured into all sorts of communicating devices in the current technological era.

The Bluetooth modules available from Enrgtrech support a wide range of bus and I/O interfaces. Products from renowned brands such as Laird Connectivity, Microchip, Panasonic, and others are included in our selection.

How to select the excellent version of the Bluetooth Module?

Bluetooth is an emerging technology since improvement is being carried out on a daily basis. This technology is classified as such. These classes range from 1, 2, or 3. The level of the device determines the class being used. The Class 1, which is considered the best and is being used in highly potential devices, is crucial and worth it if you are looking for or considering a Bluetooth device; the version is the most important thing to select.

Since the version numbers range from 1.0 to 4.0+ and are the same as the class division, the functionality levels are determined by the levels. Version numbers can also serve as a barometer for a module's range and power usage, among other characteristics. The best in its class is held by the higher end of the number range, providing a clear indicator of functionality between modules.

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PAN1455-SPP, Panasonic

Modem Modules 3.0 Bluetooth system solutions enabling integrated Bluetooth connection for your product. These modules utilise the simple AT command set for ease of design via the UART or USB peripheral interface. General Supported Profiles: RFCOMM, SPP device A and B Complete Bluetooth 3.0 + EDR solution Ultra low power design No external components except antenna where not included required On-module voltage regulator. External supply 3.0-3.6V Reference clock included Low power clock from internal oscillator or external low power clock High sensitivity design (-86 dBm typ.) Interfaces 3.25 MBaud UART, USB, I2C and SPI Interface 18 GPIOs for individual usage for your embedded software 3 Channel ADC and 1 Channel DAC Cortex-M3 ST32F103 core for embedded profiles or application software JTAG for boundary scan and debug Cut the Cable ™ Bluetooth - Panasonic

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CYBT-353027-EVAL, Infineon

The EZ-BT Module Arduino Evaluation Board (CYBT-353027-EVAL) enables you to evaluate and develop applications on the EZ-BT WICED Module, CYBT-353027-02. CYBT-353027-EVAL can be used as a standalone evaluation kit or can be combined with Arduino compatible shields. Configure the evaluation board headers/switches to the desired settings Connect the evaluation board to a PC via a USB cable Refer to KBA223509 for platform files, Makefile target generation, and HCI UART switch position setting for programming Open the WICED Studio IDE, develop your application, program and test

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CYW954907AEVAL1F, Infineon

Cypress Semiconductor Bluetooth evaluation board The Cypress semiconductor Bluetooth evaluation board is a device that enables you to evaluate and develop single-chip Wi-Fi applications using the CYW54907 device. It is single-chip 802.11ac dual-band (2.4 GHz and 5 GHz) Wi-Fi SoC that features 320-MHz Arm Cortex-R4 MCU device. This kit is supported in WICED Studio IDE. The Arduino compatibility allows to plugin off the shelf shields to expand hardware functionality for quick prototyping. Features and Benefits 5V to 12V input using USB connector or power jack Arduino compatible headers for hardware expansion Custom header to bring out additional GPIOs (WICED header) On-board PCB antenna with an option to connect external antenna On-board programmer and debugger using USB interface and USB-UART bridge One USB 2.0 Type-A to Micro-B cable RJ45 connector for Ethernet User switches and LEDs Applications Embedded IoT

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EBSKBNZWB, Taiyo Yuden

EVALUATION BOARD FOR EYSKBNZWB:

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CYBT-213043-02, Infineon

The Infineon Bluetooth Modules enables the evaluation of SIG mesh functionality using the Bluetooth 5.0 module which is an integrated, fully-certified, programmable dual-mode Bluetooth module with Bluetooth mesh support designed to reduce time-to-market. User switch Power measurement jumper Coin cell battery holder

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DVK-BT850-SA, Laird Connectivity

The Laird Connectivity development Kit with an integrated antenna for BT850-SA module. BT85x series of USB HCI modules and Adapter leverage the Cypress CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs nee Bluetooth v5.0 - Dual Mode 2-wire Cypress Global Coexistence Interface (GCI) High antenna radiation gain and efficiency Good interference rejection for multi-com system (GSM/WCDMA)

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451-00001, Laird Connectivity

The Laird Connectivity Development Kit with an integrated antenna. BL654 Series module is designed to simplify OEMs enablement of Bluetooth Low Energy (BLE) v5.1 and thread (802.15.4) to small, portable, power-conscious devices. 802.15.4 (Thread) radio support Multiple programming options Ultra-low power consumption

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453-00039R, Laird Connectivity

The Laird Connectivity BLE module with an integrated antenna (Tape/Reel). BL653 Series module is integrated with OEMs enablement of Bluetooth Low Energy (BLE) v5.1 and thread (802.15.4) to small, portable, power-conscious devices. 802.15.4 (Thread) radio support Multiple programming options No external components required

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BM70BLES1FC2-0B05BA, Microchip

The Microchip BM70 Bluetooth low energy module is designed for easy implementation into a broad range of applications. It delivers up to 2.5x throughput improvement and more secure connections vs. Bluetooth 4.1 based products. Developers can easily interface to the device via a standard UART interface, available on most Microcontrollers and Processors. The BM70 has a completely integrated Bluetooth software stack, and offers a shielded regulatory certified version with built-in antenna. Developers are freed from the complexities of Bluetooth Software and RF development and can simply utilize the BM70 as a wireline replacement. Perfect for IoT (Internet of Things) applications, when interfaced to a BLE enabled smartphone or Bluetooth Internet Gateway, applications can be monitored, controlled and updated from anywhere in the world. Mobile Application supported in Microchip Bluetooth Data (MBD) Supports UART interface Supports transparent UART data service of BLE

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453-00021R, Laird Connectivity

The Laird Connectivity Bluetooth v5 PA module integrated with External antenna T/R. BL654PA module is designed to simplify OEMs enablement of Bluetooth Low Energy (BLE) v5.0 and Thread (802.15.4) to small, portable, highly power-conscious devices. External or internal antennas Multiple programming options Compact footprint

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BGM111A256V1, Silicon Labs

Blue Gecko BGM111 Bluetooth Smart Module The Blue Gecko BGM111 Bluetooth Smart module integrates a Bluetooth 2.4GHz RF transceiver, 32-bit ARM Cortex microcontroller and a Bluetooth Smart (BLE) software stack. The on-board microcontroller allows it to operate standalone without an external processor. Bluetooth 4.1 compliant SoC, field upgradable to Bluetooth 4.2 RF Transmit Power: +8dBm Receiver Sensitivity: -91dBm @ 100kbps OTA Data Rate: 100kbps (BLE) Range: Up to 200m Chip antenna Embedded Bluetooth Smart stack with L2CAP, RFCOMM, SMP and ATT protocols supported BGAPI™ serial protocol API over UART for modem usage BGLIB™ host API/library which implements BGAPI serial protocol BGScript™ scripting language for standalone usage Profile Toolkit™ for creating GATT-based services 40MHz Cortex-M4F core microcontroller with 256KB Flash memory, 32KB RAM Advance cryptography support Host communication: serial UART with RTS/CTS flow control Serial communication: 2 x SPI and 2 x I²C Up to 25 x GPIO 4 channel 12-bit ADC @ 1Msps 12-bit DAC @ 1us Real-Time Clock & Watchdog timer Power supply: +2.4V to +3.8Vdc Can be powered from a standard 3V coin-cell battery Operating temperature range: -40 to +85°C Dimensions: 15 x 12.9 x 2.2mm Applications: Sensor communication for the Internet of Things (IoT) Note A BGM111 module development kit is also available under RS Part No 894-7134 Approvals Bluetooth, CE, FCC and IC, Japan and South-Korea qualified

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ENW89823A5KF, Panasonic

The Panasonic PAN1326C2 is a host controlled interface (HCI) Bluetooth radio frequency (RF) module that brings Texas Instruments seventh generation Bluetooth core integrated circuit, the CC2564C, to an easy-to-use module format. The PAN1326C2 is Bluetooth 5.1 compliant and it offers best-in-class RF performance with about twice the range of other Bluetooth Low Energy (LE) solutions. Bluetooth 5.1 compliant up to the HCI layer Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking) Dimensions: 9 mm ´ 9.5 mm ´ 1.8 mm Based upon Texas Instruments CC2564C Interfaces: UART, GPIO, PCM

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Bluetooth Modules

What are Bluetooth Modules?

How to select the excellent version of the Bluetooth Module?

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FAQs