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Showing Results For: Heatsinks

Heatsinks

Heat sinks are important components that help electronics, such as computers, function normally. Without heat sinks, modern computers would not be able to operate at normal speeds as it does with these components. This is because the Heatsink increases the heat flow away from the hot device. It achieves this by increasing the functional surface area of the device and the amount of low-temperature liquid that moves across the enlarged portion. Different types, designs, and aesthetics are available based on the configurations of the specific device you will use it for.

How Does a Heatsink Work?

As mentioned before, a heat sink functions by moving the air away from the heating component. Almost all of them accomplish these tasks in Four steps:

Source Generating Heat

In the first step, the source generates heat. This source could be any system that generates heat and needs to eliminate it to function normally, such as:

  • Mechanical
  • Electrical
  • Chemical
  • Nuclear
  • Solar
  • Friction

Transfer Heat Away from the Source

Heat pipes can likewise help with this cycle. In direct heat sink-contact applications, heat moves into the intensity sink and away from the source through normal conduction. The heat sink material's warm conductivity straightforwardly influences this cycle. That is why high warm conductivity materials, such as copper and aluminum, are most normal in the development of heat sinks.

Heat Distributes Through the Heat Sink

Heat will automatically move through the next heat sink through natural conduction, passing across the thermal gradient from a high to a low-temperature environment. This indicates that the heat sink's thermal status will not be consistent. Such types of sinks will be hotter towards the and cooler towards the sink's extremities. 

Heat Moves Away from the Heat Sink

This mechanism heavily depends on the heat sink's temperature gradient and operating fluid, most commonly air or a non-conductive fluid. This interaction depends on the intensity sink's temperature slope and working fluid―most generally air or a non-electrically-conductive fluid. The functioning liquid passes across the outer layer of the heat sink and uses warm dispersion and convection to eliminate heat from the surface and into the surrounding climate. 

This stage depends on, once more, a temperature gradient to eliminate heat from the sink. Consequently, no convection and ensuing heat evacuation will happen if the surrounding temperature isn't cooler than the heat sink. This progression is likewise where the whole surface region of the heat sink turns out to be generally beneficial. An enormous surface region gives an expanded region for thermal diffusion and convection to happen.

How To Choose the Right Heat Sink?

Selecting the right type of heat sink depends upon the specifics of your setup and the cooling needs. Therefore, it is crucial to identify the details of your intended application to choose the right heat sink. Some key consideration for the selection includes the following:

  • You must first consider the kind of power source from which the component will draw power.
  • Consider the amount the component needs to be kept cool for it to function normally.
  • The amount of space available to install a cooler or heat sink. You will find them in various sizes, ranging from tiny module sinks to larger installations. 
  • The type of heat sink design will offer the best thermal performance for your system specs. 
  • Choose between active or passive radiators. 
  • The amount that you are willing to spend on a cooler.

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KL-167/SW, Seifert
821 In Stock
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1328713, Phoenix Contact
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1328712, Phoenix Contact
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49 In Stock
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New Items
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0S517/50/B, AAVID THERMALLOY

0S517/50/B, AAVID THERMALLOY

The Max Clip System™ OS517 Profile Clip mounting technology offers high reliability Economic and manufacturing benefits that replace rivets and screws Simplified and rapid assembly for mounting a semiconductor to the heatsink Improved performance with the use of special thermal interface materials
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241809B92200G, AAVID THERMALLOY

241809B92200G, AAVID THERMALLOY

Heatsinks for Eighth Brick DC/DC Converters High fin density has more surface area for heat transfer, despite small foot print Thin fin geometry improves system airflow and reduces fan costs Hole pattern fits 1/8 brick DC/DC Converters from top manufacturers like Delta, Emerson and Tyco Lengthwise and crosswise fin orientations in three fin heights to allow a precise match to the application High performance QPad3™ interface pad saves time and optional hardware kit provides the complete solution under a single part number
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BGA Heatsink, Standard Standard type BGA heatsink suitable for a variety of applications. BGA Heatsinks
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PF184G, AAVID THERMALLOY
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KK071CUT-1, Carlo Gavazzi

KK071CUT-1, Carlo Gavazzi

Carlo Gavazzi KK Series Thermal Heatsink Pad Carlo Gavazzi KK Series of graphite conductive heatsink pads.
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241402B92200G, AAVID THERMALLOY

241402B92200G, AAVID THERMALLOY

Heatsinks for Quarter Brick DC/DC Converters High fin density has more surface area for heat transfer, despite small foot print Thin fin geometry improves system airflow and reduces fan costs Hole pattern fits 1/4 brick DC/DC Converters from top manufacturers like Delta, Emerson and Tyco Lengthwise and crosswise fin orientations in three fin heights to allow a precise match to the application High performance QPad3™ interface pad saves time and optional hardware kit provides the complete solution under a single part number
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122AB2000B, ABL Components

122AB2000B, ABL Components

Heat Sink 122AB Series, 200mm Wide x 15mm High ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
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0S505/50/B, AAVID THERMALLOY

0S505/50/B, AAVID THERMALLOY

The Max Clip System™ OS505 Profile Clip mounting technology offers high reliability Economic and manufacturing benefits that replace rivets and screws Simplified and rapid assembly for mounting a semiconductor to the heatsink Improved performance with the use of special thermal interface materials
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PPC0200BP, ABL Components

PPC0200BP, ABL Components

T0220 Clip-On, 9°C/W, 11°C/W It is recommended that the effectiveness of any heatsink is tested in the specific operating environment in which it will be subjected
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241409B91200G, AAVID THERMALLOY

241409B91200G, AAVID THERMALLOY

Heatsinks for Quarter Brick DC/DC Converters High fin density has more surface area for heat transfer, despite small foot print Thin fin geometry improves system airflow and reduces fan costs Hole pattern fits 1/4 brick DC/DC Converters from top manufacturers like Delta, Emerson and Tyco Lengthwise and crosswise fin orientations in three fin heights to allow a precise match to the application High performance QPad3™ interface pad saves time and optional hardware kit provides the complete solution under a single part number
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350AB1500B, ABL Components

350AB1500B, ABL Components

Flatback 125mm Wide x 50mm High With Channel ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. Note Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins.
New items
350AB1000B, ABL Components

350AB1000B, ABL Components

Flatback 125mm Wide x 50mm High With Channel ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. Note Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins.
FAQs
We offer free shipping for orders over £200 if delivery is in the UK. All other orders in the UK, shipping from £7.99 depending on the weight and measurement. Mainland Europe shipping charges start from £25. For all other countries shipping charges start from £50 for products like Heatsinks and all others.
You can email us directly at sales@enrgtech.co.uk or via our website for any queries regarding Heatsinks or any other product.
This depends on the Heatsinks individual product and information that can be found on our website.
Yes, we offer special discounts on orders above £200 for Heatsinks and all other products.
UK orders normally take between 2/3 working days. International orders normally take between 3/5 working days for all products including Heatsinks.
Yes. We keep updating our stock frequently and if a product like Heatsinks is not in stock then we will let you know.