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Wi-Fi Modules | WLAN Modules | Wi-Fi Chips | Communication & Wireless Module ICs

New items

ST60-2230C-UU, Laird Connectivity

The Laird Connectivity dual band 2x2 802.11ac WLAN plus Bluetooth 5.1 dual mode adapter it complies with M.2 2230 E-Key standard. WLAN/Bluetooth coexistence protocol support Shared LNA with WLAN/Bluetooth 20/40/80 MHz channel bandwidths support

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New items

453-00014R, Ezurio

Sterling-EWB integrated with chip antenna module. Sterling™-EWB is a high performance 2.4 GHz WLAN and Bluetooth combo module based on latest-generation silicon (Cypresss CYW4343W) with an integrated ST Micro STM32F412 Cortex M4 MCU. Bluetooth 5.1 (Errata) BR DR/LE Cortex M4 microprocessor Operating voltage: 3.0V to 3.6V Operating temperature: -40° to +85° C

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New items

453-00186, Ezurio

The Ezurio Sona IF513 series wireless module is an integrated, small form factor Wi-Fi/Bluetooth module that is optimized for low power mobile devices. The integration of all WLAN and Bluetooth functionality in a single package supports a low cost and simple implementation along with flexibility for platform specific customization. The radio is pre calibrated and integrates the complete transmit and receive RF paths including band pass filter, diplexer, switches, reference crystal oscillator and power management units. Supports IEEE 802.11ax tri band 1x1 MIMO With data rates up to MCS11 Low power consumption Radio architecture Power management unit

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New items

453-00195, Ezurio

The Ezurio Sona IF513 series wireless module is an integrated, small form factor Wi-Fi/Bluetooth module that is optimized for low power mobile devices. The integration of all WLAN and Bluetooth functionality in a single package supports a low cost and simple implementation along with flexibility for platform specific customization. The radio is pre calibrated and integrates the complete transmit and receive RF paths including band pass filter, diplexer, switches, reference crystal oscillator and power management units. Supports IEEE 802.11ax tri band 1x1 MIMO With data rates up to MCS11 Low power consumption Radio architecture Power management unit

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New items

LE910C1 IF (**WWX), Telit

The Telit LE910Cx series of 4G LTE modules are compliant with the 3GPP Release 10 and are available with optional quad constellation GNSS capability. This compact LGA form factor family is available in a variety of configurations, supporting both single mode and fallback as needed for specific regions, carriers, and use cases. Best in class 3GPP rel10 platform MTC features ready according to 3GPP Rel.12 Embedded GNSS solution

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New items

CMB100A0-WW, Telit

The Telit CMB100 series Module Board-CAT4 is Telit Cinterions first generation of LTE modules certified for end devices. These modules provide the ability to add reliable LTE connectivity to products. Its offers ideal platform for IoT applications, mobile data and ultra compact computing devices with extended operating temperature range. Standard mini berg connector with 20 mm pitch Best in class 3GPP Release 10 platform Battery friendly 1.8 V GPIO GPIO level translation for 3.3 V system 2G and 3G fallback and GNSS for accurate location services

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New items

FN920C04-WW, Telit

The Telit 5G RedCap module enables 5G mid speed connectivity relying on the latest 3GPP Release 17 Redcap technology. It levels up performance and efficiency, promising the highest level of flexibility by offering a single SKU, global M.2 card form factor that allows customers to move to a secure 5G future easily. Global design for full flexibility and longevity with 5G technology Security by design securing devices and device to cloud Improved operational efficiency and precise GNSS positioning with support

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New items

SE873K5, Telit

The Telit Multi constellation receiver in 7x7x2.25 mm QFN-like package including embedded flash, RTC and TCXO, as well as a pre selection SAW filter for coexistence with other radio technologies, it also includes an adjustable eLNA for usage with either active or passive antennas. Battery friendly 1.8 V GPIO Flexible power management modes allow improvement to the battery life SAW filter for better immunity and integrated LNA for optimal performances

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New items

WE310K6-P, Telit

The Telit IoT Module is a fully integrated dual band, dual stream combo Wi-Fi (802.11 a/b/g/n/ac/ax) / Bluetooth® / Bluetooth® Low Energy 5.2 module, that provides an easy, cost effective way for manufacturers to add wireless connectivity to their products. It is an ideal solution for organizations with limited WiFi/Bluetooth Low Energy or RF expertise or for those seeking faster time to market, as it reduces RF design time and removes the burden of testing and certification. Certified Module RoHS and REACH compliant Two Form Factor of LGA and M.2 Bluetooth® AUDIO Isochronous Channel support

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New items

WFI32E03PE-I, Microchip

The Microchip high-performance Wi-Fi MCU module features a PCB antenna and 2 MB of program memory, making it ideal for industrial applications. Its powerful capabilities ensure reliable wireless connectivity and efficient data handling, while the 2 MB of program memory provides ample space for complex firmware and application code. This module is perfect for IoT devices, smart sensors, and other industrial automation systems that require stable and scalable wireless communication. Optional full featured hardware crypto accelerator PCB antenna CE certification

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New items

CYW43022CUBT, Infineon

The Infineon AIROC CYW43022 an ultra low power single chip, combo device features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 5 (802.11ac) and Bluetooth 5.4. With a low power architecture, the CYW43022 is ideal for battery powered applications where best-in-class power consumption is critical. An embedded Bluetooth stack and Wi-Fi networking offloads allow the CYW43022 to maintain connectivity activity even while a host processor is in low-power sleep mode. PCM host interface for audio data Complies with Bluetooth core specification version 5.4 Internal PA and LNA for both bands 40 GPIOs

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New items

453-00072C, Ezurio

The Laird Connectivity summit SOM 8M plus is powered by NXPs innovative i.MX 8M plus processor and 88W8997 wireless silicon coupled with onboard NXP PMICs (PCA9450CHN and PM823UK), performance LPDDR4 RAM, and eMMC 5.1 storage and combine this with long term support summit yocto linux, secure enclave, and summit linux FIPS core crypto to offer a comprehensive hardware and software solution throughout products. Summit SOM 8M Plus Quad Core CPU 2GB LPDDR4 16GB Embebed Multimedia Card Cut Tape

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